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Laird A15336-01 A15336-01 Thermal Pad Tflex 300 Series 1.2 W/m.K Silicone Elastomer 4 mm 229

Laird A15336-01 A15336-01 Thermal Pad Tflex 300 Series 1.2 W/m.K Silicone Elastomer 4 mm 229

The A15336-01 is a 4mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex� 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex� 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.
  • Extreme compliancy allows material to totally blanket components
  • Low compression set enables the pad to be reused many times
  • UL94V-0 Flammability rating
  • -40 to 160°C Operating temperature
  • ±10% Thickness tolerance
  • 0.56% Out-gassing TML
  • 0.10% Out-gassing CVCM
  • 600ppm/c Coefficient thermal expansion (CTE)
Applications

Thermal Management, Communications & Networking, Computers & Computer Peripherals, Power Management, Lighting, LED Lighting, Automotive

Other details

Brand LAIRD
Part Number A15336-01
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Image is for illustrative purposes only. Please refer to product description.

$20.87

Original: $69.56

-70%
Laird A15336-01 A15336-01 Thermal Pad Tflex 300 Series 1.2 W/m.K Silicone Elastomer 4 mm 229

$69.56

$20.87

Product Information

Shipping & Returns

Description

The A15336-01 is a 4mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex� 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex� 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.
  • Extreme compliancy allows material to totally blanket components
  • Low compression set enables the pad to be reused many times
  • UL94V-0 Flammability rating
  • -40 to 160°C Operating temperature
  • ±10% Thickness tolerance
  • 0.56% Out-gassing TML
  • 0.10% Out-gassing CVCM
  • 600ppm/c Coefficient thermal expansion (CTE)
Applications

Thermal Management, Communications & Networking, Computers & Computer Peripherals, Power Management, Lighting, LED Lighting, Automotive

Other details

Brand LAIRD
Part Number A15336-01
Quantity Each
Technical Data Sheet EN Download technical document - datasheet - Tanotis India

All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Image is for illustrative purposes only. Please refer to product description.

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