TE Connectivity 2317857-2 Dust Cap / Cover & EMI AMP Osfp I/O Connectors Zinc Alloy Body
TE's octal small form-factor pluggable (OSFP) I/O connectors support aggregatedata rates up to 200 Gbps (8 x 28G NRZ) and 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps
- Applications: Servers, Switches, Storage Devices, Routers etc.
Communications & Networking, Data / Computing, Industrial, Telecommunications
Other details
| Brand | TE CONNECTIVITY |
| Part Number | 2317857-2 |
| Quantity | Each |
| 3D Product Image EN |  |
| Drawing EN | |
| CAD Multiple Formats EN | |
All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Image is for illustrative purposes only. Please refer to product description.
$11.62
TE Connectivity 2317857-2 Dust Cap / Cover & EMI AMP Osfp I/O Connectors Zinc Alloy Body—
$11.62
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Product Information
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Shipping & Returns
Description
TE's octal small form-factor pluggable (OSFP) I/O connectors support aggregatedata rates up to 200 Gbps (8 x 28G NRZ) and 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps
- Applications: Servers, Switches, Storage Devices, Routers etc.
Communications & Networking, Data / Computing, Industrial, Telecommunications
Other details
| Brand | TE CONNECTIVITY |
| Part Number | 2317857-2 |
| Quantity | Each |
| 3D Product Image EN | |
| Drawing EN | |
| CAD Multiple Formats EN | |
All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Image is for illustrative purposes only. Please refer to product description.
